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32.1.1 Purpose and Functions of Surface Finishes The printed circuit board (PCB) conductor surface finish forms a critical interface between the component and the interconnection circuitry. As its most essential function, the final finish process is intended to provide exposed copper circuitry with a protective coating in order to preserve solderability. In a more expanded view, the final finish coating must meet dozens of functional criteria, including solderability, environmental, electrical, physical, and durability demands, as summarized in this chapter. Perhaps no other step in the PCB manufacturing process has undergone more change in the era of surface mount manufacturing than the final finish chemical process. A wide variety of functional, environmental, engineering, cost, productivity, and failure mode issues have contributed to this frequent change.

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Create QR Code in Windows 10 UWP - Edi.Wang
4 Feb 2017 ... A year ago, I wrote an UWP application that can generate QR Code . However, at that time, the QR Code library I used was ZXing.Net, the last ...

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32.1.2 Impact of the Lead-Free Transition The impact of lead-free manufacturing, as a result of the Waste Electrical and Electronic Equipment (WEEE) directive and Restriction on Hazardous Substances (RoHS), has changed surface finish specifications for PCBs and the soldering of those surfaces at assembly. Lead-free assembly has changed just about every aspect of the surface finish technology. The elimination of lead (Pb) in most designs has rendered the standard surface finish hot air solder level (HASL) increasingly obsolete. At assembly, the use of new solder alloys affects the compatibility of the finishes with the metallurgy of the final solderjoint. Many of the assembly issues related to surface finishes, such as surface-mount technology (SMT) pad wettability, plated through hole (PTH) fill, and voiding are exacerbated by the Pb-free assembly process. Finally, the temperature of Pb-free soldering has a major impact on the shelf-life and solderability of the Pb-free finishes.

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and the watchdog (if enabled) continue operating. Only an external reset, a watchdog reset (if enabled), or an external level interrupt on INT0 or INT1 can wake up the MCU. Note that when a level-triggered interrupt is used for wake up from power down, the low level must be held for a time longer than the reset delay time-out period tTOUT. Otherwise, the device will not wake up. Figure 3.42 illustrates the current consumption by a Tiny22 processor during the active and power-down modes of operation.

Technology Drivers Each company in the manufacturing supply chain has needs specific to its manufacturing step. The methods used to achieve these goals have evolved with developments in PCB technology. Historically, technicians were able to solder components directly to copper using very active fluxes. When PCBs were first made in large production quantities, chemists devised ways to protect the copper using metal or organic coatings. Electroplated tin-lead became a popular coating as a metallic layer that could be subsequently reflowed. Design changes forced the era of solder mask over bare copper (SMOBC). With SMOBC, reflowed plated tin-lead was no longer possible because the tin-lead liquefies during the soldering process. HASL, the successor to plated tin-lead, became the surface finish of choice worldwide. Increasing PCB circuit density inspired the reemergence of organic coatings, such as new formulation organic solderability preservatives (OSPs) and metallic layers such as electroless nickel/immersion gold (ENIG.) The environmental initiative to eliminate ozone-depleting chemicals led to the next change in surface finish preference. Use of no-clean assembly operations prompted a decline in OSP and an increase in ENIG. Both ENIG and OSP continue to be widely used, but each has its own weakness, allowing for the proliferation of new low-cost, high-functional immersion metal finishes such as immersion silver and immersion tin. 32.1.3.1 Fabrication Requirements. The company producing the bare printed circuit board that is, the PCB fabricator has needs that are specific to that business, as follows:

Low chemical and process cost Simple operation (low engineering demands) Reworkability Easily measured thickness Conveyorized equipment Electrically testable surface No sensitivity to poor handling Long shelf-life Inexpensive processing equipment and high throughput No attack of soldermask No toxic chemicals (waste should be easily treated) Specification by most original equipment manufacturer (OEM) customers Capability of being selectively coating with electroplated gold

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32.1.3.2 Assembly Requirements. The assembly engineers, whether contract Electronics Manufacturing Services (EMS) provider, independent original design manufacturer (ODM), or captive OEM, have requirements that are very different from those of the PCB fabrication customer:

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UWP Bar code generator - MSDN - Microsoft
https://social.msdn.microsoft.com/Forums/en-US/602cb464-2ebc-4d72-9fde- 7f384c9208b6/open-source- barcode - generator -for-code39?forum ...

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