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Flat surface for stenciling paste Low contact resistance for in-circuit test (ICT) Tolerance for paste misprint cleaning Long incoming shelf-life (more than one year) Long midassembly shelf-life (more than two weeks) Compatibility with all pastes and fluxes Capability of bonding with Al and/or Au wire

The ability to be visually inspected (prevents solder mask residue non-wetting) Ease of handling Excellent and predictable wettability Fiducial recognition No warp and twist of the PCB Good compliant pin and connector contacts Good Pb-free soldering with no need for nitrogen No solder bridging or plugged holes The original equipment manufacturer has the following

32.1.3.3 OEM Requirements. additional requirements:

The AVR family offers many controllers with different peripheral resources, program memory, and packaging styles. Table 3.11 illustrates the available controllers and their features.

Best solderjoint reliability; strong intermetallic No impact on cost of bare board Prevention of defects (black-pad, voiding, whiskers) Corrosion resistance in uncontrolled field environments Usefulness as an electrical test point and EMI shield Functionality as a touchpad/keypad contact Good electrical performance of high-speed signals Adherence to industry-consensus specifications Complete documentation from the chemical supplier Established supply base of installed fabricators Audited fabricators

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315 400 400 500 210 230 570 630 125 135 182 198 125 135 214 232 62 68 119 131 62 68 151 165 18 20 43 47 18 20 54 60 0 0 25 27 0 0 36 40 0 0 89 97 0 0 140 155 0 0 360 400 +7 +7 18 20 +18 +20 18 20 +29 +32 +4 +5 +40 +45 +4 +5 +46 +50 +21 +23 +57 +63 +21 +23 +62 +67 +37 +40 +73 +80 +37 +40 +98 +108 +62 +68

Surface finishes available in the PCB industry are as follows:

HASL Reflowed tin-lead ENIG OSP Antitarnish and preflux Immersion silver Immersion tin Electroless palladium (Pd) Electrolytic nickel/electrolytic gold Electroless gold Direct immersion gold Solid solder deposit Table 32.1 shows these alternative surface finishes and their typical thicknesses.

TABLE 32.1 Major Surface Finish Options with Typical Thickness PCB surface finish Hot Air Solder Level Organic Solderability Preservative Electroless Nickel/Immersion Gold Immersion Silver Immersion Tin Typical thickness 2 40 mm (80 1600 min) 0.1 0.6 mm (4 24 min) 3 5 mm (120 200 min) 0.05 0.15 mm (2 6 min) 0.1 0.4 mm (4 16 min) 0.6 1.2 mm (24 48 min)

Nickel: Gold:

Precision Engineering Limits and fits for the basic shaft system [12]

Figure 32.1 shows the estimated usage of these surface finishes, indicating that no single finish will satisfy all needs. These are discussed in the following sections.

Active and Power Down mode current consumption in AVR Tiny22 processor (internal oscillator mode)

FIGURE 32.1 Worldwide surface finish usage estimates by (a) dollar amount and (b) area share of PCBs manufactured.

HOT AIR SOLDER LEVEL (HASL OR HAL)

HASL is the process of immersing a circuit board into molten solder. For the vast majority of HASL applications, the solder alloy is tin-lead. For Pb-free applications, the main alloys include tin-copper, tin-silver-copper, tin-copper-nickel, and tin-copper-nickel-germanium alloys. The thickness and texture of the HASL surface result from the surface tension of molten solder. As such, the thickness varies from 2 to 20 mm or more. HASL boards demonstrate excellent shelflife, solderability protection, and resistance to poor handling, but they do tend to have higher levels of residual ions left over from fluxing. The HASL operation forms an intermetallic with copper circuitry at the PCB shop. This extra thermal step, with the associated loss in copper, is a concern for Pb-free assemblies. Expansion of the PCB substrate at high temperatures can warp and twist the board.The dimensional movement, along with uneven pad flatness and plugged vias, makes assembling dense circuitry (less than 0.5 mm pitch) difficult or impossible. The worldwide decline of HASL is partly due to assembly concerns and partly due to Pb restrictions.

.

Fabrication Process HASL can be applied in vertical or horizontal equipment. As a pretreatment, the copper is cleaned, microetched, and fluxed. It is common for the HASL pretreatment steps to be carried out in conveyorized equipment, and then the panel to be transferred to a vertical machine that dips the individual panel into molten solder. As the panel is raised, air knives

blow off excess solder. To handle the very high temperatures of the molten alloy, equipment is manufactured from stainless steel, titanium, and other alloys. Aggressive rinsing is needed to remove flux residues, as the HASL process is potentially much dirtier than other surface finish processes. Surface finishing engineers must be aware of safety concerns, such as exposure to Pb and the possibility of equipment fires. 32.3.2 Advantages and Disadvantages Table 32.2 compares advantages and disadvantages of HASL.

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