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Symbol Diameter limit and grade Over 1 3 6 10 18 30 50 80 Up to 3 6 10 18 30 50 80 120 With large d11 20 30 40 50 65 80 100 120 min clearance 80 105 130 160 195 240 290 340 With medium e7 14 20 25 32 40 50 60 72 minimum 24 32 40 50 61 75 90 107 clearance e8 14 20 25 32 40 50 60 72 28 38 47 59 73 89 106 126 With small f7 6 10 13 16 20 25 30 36 minimum 16 22 28 34 41 50 60 71 clearance f8 6 10 13 16 20 25 30 36 20 28 35 43 53 64 76 90 With smallest g5 2 4 5 6 7 9 10 12 minimum 6 9 11 14 16 20 23 27 clearance g6 2 4 5 6 7 9 10 12 8 12 14 17 20 25 29 34 h5 0 0 0 0 0 0 0 0 4 5 6 8 9 11 13 15 h6 0 0 0 0 0 0 0 0 6 8 9 11 13 16 19 22 h8 0 0 0 0 0 0 0 0 14 18 22 27 33 39 46 54 h9 0 0 0 0 0 0 0 0 25 30 36 43 52 62 74 87 h11 0 0 0 0 0 0 0 0 60 75 90 110 130 160 190 220 j5 +2 +3 +4 +5 +5 +6 +6 +6 2 2 2 3 4 5 7 9 j6 +4 +6 +7 +8 +9 +11 +12 +13 2 2 2 3 4 5 7 9 k5 +4 +6 +7 +9 +11 +13 +15 +18 0 +1 +1 +1 +2 +2 +2 +3 Secure k6 +6 +9 +10 +12 +15 +18 +21 +25 against 0 +1 +1 +1 +2 +2 +2 +3 turning m5 +6 +9 +12 +15 +17 +20 +24 +28 +2 +4 +6 +7 +8 +9 +11 +13 m6 +8 +12 +15 +18 +21 +25 +30 +35 +2 +4 +6 +7 +8 +9 +11 +13 n5 +8 +13 +16 +20 +24 +28 +33 +38 +4 +8 +10 +12 +15 +17 +20 +23 n6 +10 +16 +19 +23 +28 +33 +39 +45 +4 +8 +10 +12 +15 +17 +20 +23 p6 +12 +20 +24 +29 +35 +42 +51 +59 +6 +12 +15 +18 +22 +26 +32 +37 r6 +16 +23 +28 +32 +41 +50 +10 +15 +19 +23 +28 +34 s6 +20 +27 +32 +39 +48 +59 +14 +19 +23 +28 +35 +43 H6 +6 +8 +9 +11 +13 +16 +19 +22 0 0 0 0 0 0 0 0 Basic hole H7 +10 +12 +15 +18 +21 +25 +30 +35 0 0 0 0 0 0 0 0 H8 +14 +18 +22 +27 +33 +39 +46 +54 0 0 0 0 0 0 0 0 H9 +25 +30 +36 +43 +52 +62 +74 +87 0 0 0 0 0 0 0 0 H11 +60 +75 +90 +110 +130 +160 +190 +220 0 0 0 0 0 0 0 0.

Just as the name implies, MCM technology mounts multiple, unpackaged ICs (bare die), along with signal conditioning or support circuitry such as capacitors and resistors, to form a system, or a subsystem on a single substrate.1 In fact, in the late 1980s and early 1990s, MCMs were considered to be the ultimate interconnect and packaging solution, capable of meeting every challenge of the electronics industry. This technology placed ICs in close proximity to each other, thereby enhancing system performance by reducing interconnect delay.15 Size is often the primary driver for MCM-based systems. The typical multicomponent discrete assembly provides a silicon-to-board efficiency of <10 percent (actual total die area versus the total printed circuit board area). MCM technology can often increase the silicon-to-board efficiency to 35 or 40 percent with chip and wire assembly processes, and to 50 percent or higher with some of the higher-density processes.16 Thus, with reduced size and weight, MCMs offer a practical approach to reducing overall system size while providing enhanced performance due to a reduction in the interconnect distance between chips.1 Multichip modules typically use three to five times less board area than their equivalent discrete solution.16

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Since a multichip module is, by definition, a single substrate containing two or more ICs, it is unlikely that they are a thing of the past. Instead, they have been renamed from MCMs to MCPs, few chip packages (FCPs), or other similarly descriptive names. These packaging solutions usually contain from about two to six ICs that are packed onto an inexpensive laminate substrate. Although they are multichip modules, they may be called something else. Intel refers to its twochip package as a CSP, although in fact it is an MCP or MCM .17 Interestingly, some still believe that when time is an important consideration while reaching the market with a low-cost and reliable product, multichip solutions win. On the other hand, others believe that it s only a matter of time before SOCs take over completely and multichip packaging will not be necessary, and they view multichip solutions only as stopgaps.18 Nevertheless, regardless of their nomenclature, laminate based multifunctional packages are among the key package types in the industry.

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